Why Better @ Boschman
Boschman is a high-tech, technology driven company, specialised in advanced back-end semiconductor packaging solutions. We are a privately owned business, headquartered in the Netherlands with a final assembly plant in Singapore.
We have a dynamic, involved and solution driven working environment, where expertise, teamwork and results are highly valued.
Feel welcome to join our high-tech, worldwide operating family business.
Our Better Boschman Vacancies
How we hire better
Getting to know you
In the first call, let our recruiter learn about you and your story to check a potential fit to Boschman. This is also a chance for you to ask first questions about the role and company.
Manager’s interview
In this meeting, your future Leader takes a deeper dive into your experience and what you could bring to the team. You can expect questions on how knowledgeable you are in the business or technology area.
Team interview
We want you to meet your future colleagues. Have a look if it really fits you!
Offer / Contract
If you are happy, we are happy. It's time to go on an adventure with us!
You’ll be right at the heart of major projects, working with teams of passionate people and helping us to create the next awesome thing.
Eef Boschman CEO at Boschman Advanced Packaging Technology
More reasons to join us
Feel at home in our family business, in a high-tech and informal working environment with open and direct communication
You will join a successful international operating family business, with a bright future ahead
We offer technologically challenging work, in which you will be really able to use and develop your technical skills
About Boschman
Boschman is a high-tech, technology driven company, specialised in advanced back-end semiconductor packaging solutions. We are a privately owned business, headquartered in the Netherlands with a final assembly plant in Singapore.
We focus on Pressure Sintering and Transfer Molding, two technologies that are in high demand now as the world is converting to elevated levels of electrification, creating unprecedented opportunities for companies active in the power electronics supply chain, like Boschman Advanced Packaging Solutions.
Core to our strategy is a unique business model, “from Idea to Industrialization,” with three highly complementary activities:
Package Development: co-development of semiconductor packages and processes, including concept and design for manufacturing (DFM), prototyping and engineering samples for our (end) customers. Historically this activity focused on MEMS and Sensors, but currently shifting towards Power Modules and Inverters, driven by market demand in the xEV segment.
Assembly Services: small to medium volume micro assembly of MEMS, Sensors and Power Modules, with a fully equipped inhouse lab (from wafer dicing to die attach bonding, molding and laser marking). For higher production volumes, we offer a technology transfer service to inhouse our OSATs manufacturing.
Equipment: pressure sintering & transfer molding equipment, a range of systems from R&D Labs High Volume production solutions.
